Enhanced Version Desktop Host Graphics Card CPU Air Cooled Radiator CPU Cooler Six Copper Tube Mute Multi-Platform
Enhanced Version Desktop Host Graphics Card CPU Air Cooled Radiator CPU Cooler Six Copper Tube Mute Multi-Platform
Enhanced Version CPU Air Cooled Radiator CPU Cooler Six Copper Tube Mute Multi-Platform - from factory direct to you. Quality and performance guaranteed.
Dazzling flow! Six heat pipes! PWM Intelligent control！ Multi-platform compatibility-Intel/AMD! Enhanced version, screw buckle!Dazzling light effect! 120mm Dazzle fan glows from the inside to enjoy color freedom PWM Intelligent temperature control fan. The CPU speed is automatically adjusted with the CPU temperature. In addition to the aesthetic appeal, the Dazzle fan also incorporates PWM (Pulse Width Modulation) intelligent temperature control. This means that the fan's speed is automatically adjusted based on the CPU temperature. As the CPU temperature increases, the fan speed will increase accordingly to provide efficient cooling and maintain optimal temperature levels. The intelligent temperature control feature ensures that the fan operates at the necessary speed to effectively dissipate heat from the CPU, while also minimizing noise and power consumption. This helps to maintain a balance between cooling performance and overall system efficiency.HDT Compaction technique! The steel pipe has zero contact with the CPU surface. The cooling and heat absorption effect is more significant. The HDT (Heatpipe Direct Touch) compaction technique refers to a design feature in which the heat pipes are flattened, allowing them to have direct contact with the CPU surface. Unlike traditional heat sinks where there is a base plate between the heat pipes and the CPU, the HDT design aims to maximize the contact area and enhance heat transfer efficiency. In the HDT compaction technique, the heat pipes are flattened and shaped to create a flat surface that directly touches the CPU. This direct contact allows for efficient heat transfer from the CPU to the heat pipes, as there is no additional material or interface layer in between. By eliminating any potential thermal resistance, the HDT design can achieve better and faster heat dissipation. The absence of a base plate between the heat pipes and the CPU surface means that there is no gap or air layer that can hinder heat transfer. This direct contact enables efficient heat absorption from the CPU, ensuring that the heat is quickly transferred to the heat pipes for dissipation. The cooling and heat absorption effect is more significant with the HDT compaction technique due to the improved contact between the heat pipes and the CPU. This results in better thermal conductivity and enhanced cooling performance. The direct contact also helps to prevent hotspots and evenly distribute the heat across the heat pipes, preventing localized overheating.Six heat pipes straight contact! Direct contact between the heat pipes and the CPU allows for better and faster heat transfer, as there is no additional material or interface between them. This helps to minimize any thermal resistance and maximize the efficiency of heat dissipation.Fin piercing process! The contact area between the fin and the heat pipe is increased. Effectively improve the heat transfer efficiency Multi-platform compatibility! Intel:115x/1200/1366/1700 AMD:AM4/AM3(+)
Dazzling light effect! 120mm Dazzle fan glows from the inside to enjoy color freedom PWM Intelligent temperature control fan. The CPU speed is automatically adjusted with the CPU temperature. In addition to the aesthetic appeal, the Dazzle fan also incorporates PWM (Pulse Width Modulation) intelligent temperature control. This means that the fan's speed is automatically adjusted based on the CPU temperature. As the CPU temperature increases, the fan speed will increase accordingly to provide efficient cooling and maintain optimal temperature levels. The intelligent temperature control feature ensures that the fan operates at the necessary speed to effectively dissipate heat from the CPU, while also minimizing noise and power consumption. This helps to maintain a balance between cooling performance and overall system efficiency.HDT Compaction technique! The steel pipe has zero contact with the CPU surface. The cooling and heat absorption effect is more significant. The HDT (Heatpipe Direct Touch) compaction technique refers to a design feature in which the heat pipes are flattened, allowing them to have direct contact with the CPU surface. Unlike traditional heat sinks where there is a base plate between the heat pipes and the CPU, the HDT design aims to maximize the contact area and enhance heat transfer efficiency. In the HDT compaction technique, the heat pipes are flattened and shaped to create a flat surface that directly touches the CPU. This direct contact allows for efficient heat transfer from the CPU to the heat pipes, as there is no additional material or interface layer in between. By eliminating any potential thermal resistance, the HDT design can achieve better and faster heat dissipation. The absence of a base plate between the heat pipes and the CPU surface means that there is no gap or air layer that can hinder heat transfer. This direct contact enables efficient heat absorption from the CPU, ensuring that the heat is quickly transferred to the heat pipes for dissipation. The cooling and heat absorption effect is more significant with the HDT compaction technique due to the improved contact between the heat pipes and the CPU. This results in better thermal conductivity and enhanced cooling performance. The direct contact also helps to prevent hotspots and evenly distribute the heat across the heat pipes, preventing localized overheating.Six heat pipes straight contact! Direct contact between the heat pipes and the CPU allows for better and faster heat transfer, as there is no additional material or interface between them. This helps to minimize any thermal resistance and maximize the efficiency of heat dissipation.Fin piercing process! The contact area between the fin and the heat pipe is increased. Effectively improve the heat transfer efficiency Multi-platform compatibility! Intel:115x/1200/1366/1700 AMD:AM4/AM3(+)
